• HOME
  • NEWS
    • BIOENGINEERING
    • SCIENCE NEWS
  • EXPLORE
    • CAREER
      • Companies
      • Jobs
    • EVENTS
    • iGEM
      • News
      • Team
    • PHOTOS
    • VIDEO
    • WIKI
  • BLOG
  • COMMUNITY
    • FACEBOOK
    • FORUM
    • INSTAGRAM
    • TWITTER
  • CONTACT US
Thursday, February 25, 2021
BIOENGINEER.ORG
No Result
View All Result
  • Login
  • HOME
  • NEWS
    • BIOENGINEERING
    • SCIENCE NEWS
  • EXPLORE
    • CAREER
      • Companies
      • Jobs
        • Lecturer
        • PhD Studentship
        • Postdoc
        • Research Assistant
    • EVENTS
    • iGEM
      • News
      • Team
    • PHOTOS
    • VIDEO
    • WIKI
  • BLOG
  • COMMUNITY
    • FACEBOOK
    • FORUM
    • INSTAGRAM
    • TWITTER
  • CONTACT US
  • HOME
  • NEWS
    • BIOENGINEERING
    • SCIENCE NEWS
  • EXPLORE
    • CAREER
      • Companies
      • Jobs
        • Lecturer
        • PhD Studentship
        • Postdoc
        • Research Assistant
    • EVENTS
    • iGEM
      • News
      • Team
    • PHOTOS
    • VIDEO
    • WIKI
  • BLOG
  • COMMUNITY
    • FACEBOOK
    • FORUM
    • INSTAGRAM
    • TWITTER
  • CONTACT US
No Result
View All Result
Bioengineer.org
No Result
View All Result
Home NEWS Science News

UTA aims to build a better microchip

Bioengineer by Bioengineer
January 29, 2021
in Science News
0
Share on FacebookShare on TwitterShare on LinkedinShare on RedditShare on Telegram

Electrical engineer works to improve on-chip interconnect performance

IMAGE

Credit: UT Arlington

A University of Texas at Arlington electrical engineer is investigating how to improve intermediate interconnects on increasingly complex microchips that will lead to better performance of very large-scale integration (VLSI) circuits and systems.

Assistant Professor Chenyun Pan received a four-year, $230,000 grant from the Interuniversity Microelectronics Centre (IMEC) for the work.

VLSI is the process of creating an integrated circuit by fabricating billions of transistors on a single chip. It is at the core of semiconductor and telecommunication technologies. Interconnects are wires on chips used in generic microprocessors or integrated circuits, with lengths typically ranging from tens of nanometers to millimeters.

Pan hopes that his research will help determine how different materials and geometric structures used in intermediate-length interconnects can lead to greater efficiency as the semiconductor manufacturing process becomes smaller and smaller. He will explore new materials–including alternative metals, ballistic materials and optical or plasmonic materials–and investigate new interconnect structures and transmission lines.

“As chip technology continues to shrink, on-chip interconnects impose severe limitations on chip-level performance,” Pan said. “More than half of delays and power dissipation on chips are associated with interconnection networks.

“Traditionally, copper is used to make interconnects, but its large resistivity leads to significant lags in performance. We aim to find novel materials and transmission mechanisms that will alleviate the interconnect challenge and deliver improved chip speed.”

Pan’s connection to IMEC provides an important link between the University and industry, a necessary connection in the collaborative climate of research and development, said Diana Huffaker, chair of UTA’s Electrical Engineering Department.

“IMEC is the foremost research center and arguably the gold standard for basic research to industrial development in the world,” Huffaker said. “Dr. Pan’s continued collaboration with it is impressive and speaks to his ability and creativity as a researcher. I hope that this will lead to many more opportunities for him and for our department.”

Pan joined UTA in 2019. He was a researcher at IMEC’s headquarters in Leuven, Belgium, from 2014-15, focusing on emerging graphene interconnects and deeply scaled vertical field-effect transistors.

###

IMEC is a research and development hub for nano- and digital technologies. A trusted partner for companies, startups, and academia, IMEC offers a creative and stimulating environment with more than 4,000 researchers in 90 countries. IMEC works with many different partners, ranging from governmental agencies to universities to major semiconductor industrial partners, such as Intel, ARM, TSMC and Samsung.

– Written by Jeremy Agor, College of Engineering

Media Contact
Herb Booth
[email protected]

Original Source

https://www.uta.edu/news/news-releases/2021/01/29/pan-microchips

Tags: Electrical Engineering/ElectronicsSuperconductors/SemiconductorsTechnology/Engineering/Computer Science
Share12Tweet8Share2ShareShareShare2

Related Posts

IMAGE

A cat of all trades

February 25, 2021
IMAGE

Study: Bladder cancer is more advanced in South Texas

February 25, 2021

NTU scientists develop laser system that generates random numbers at ultrafast speeds

February 25, 2021

Scientists probe electronic angular momentum to a chemical reaction for the first time

February 25, 2021

Leave a Reply Cancel reply

Your email address will not be published.

This site uses Akismet to reduce spam. Learn how your comment data is processed.

POPULAR NEWS

  • IMAGE

    Terahertz accelerates beyond 5G towards 6G

    637 shares
    Share 255 Tweet 159
  • People living with HIV face premature heart disease and barriers to care

    81 shares
    Share 32 Tweet 20
  • Global analysis suggests COVID-19 is seasonal

    37 shares
    Share 15 Tweet 9
  • HIV: an innovative therapeutic breakthrough to optimize the immune system

    35 shares
    Share 14 Tweet 9

About

We bring you the latest biotechnology news from best research centers and universities around the world. Check our website.

Follow us

Tags

Technology/Engineering/Computer SciencePublic HealthEcology/EnvironmentGeneticsCell BiologyClimate ChangeMaterialsMedicine/HealthcancerChemistry/Physics/Materials SciencesInfectious/Emerging DiseasesBiology

Recent Posts

  • A cat of all trades
  • Study: Bladder cancer is more advanced in South Texas
  • NTU scientists develop laser system that generates random numbers at ultrafast speeds
  • Scientists probe electronic angular momentum to a chemical reaction for the first time
  • Contact Us

© 2019 Bioengineer.org - Biotechnology news by Science Magazine - Scienmag.

No Result
View All Result
  • Homepages
    • Home Page 1
    • Home Page 2
  • News
  • National
  • Business
  • Health
  • Lifestyle
  • Science

© 2019 Bioengineer.org - Biotechnology news by Science Magazine - Scienmag.

Welcome Back!

Login to your account below

Forgotten Password?

Create New Account!

Fill the forms below to register

All fields are required. Log In

Retrieve your password

Please enter your username or email address to reset your password.

Log In