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		<title>New Optimization Model Prevents Capacity Overestimation in 3D-Stacked HBM Manufacturing</title>
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		<pubDate>Sat, 17 Oct 2026 12:36:47 +0000</pubDate>
				<category><![CDATA[Technology]]></category>
		<category><![CDATA[3D stacking]]></category>
		<category><![CDATA[AI chips]]></category>
		<category><![CDATA[capacity planning]]></category>
		<category><![CDATA[CPLEX]]></category>
		<category><![CDATA[DRAM]]></category>
		<category><![CDATA[HBM]]></category>
		<category><![CDATA[mixed-integer optimization]]></category>
		<category><![CDATA[production planning]]></category>
		<category><![CDATA[semiconductor manufacturing]]></category>
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					<description><![CDATA[A new mixed-integer optimization framework explicitly models the stacking factors of 4-, 8-, 12-, and 16-layer HBM to prevent capacity overestimation in AI-driven memory manufacturing.]]></description>
		
		
		
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