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	<title>semiconductor scaling challenges &#8211; BIOENGINEER.ORG</title>
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		<title>Complementary 2D Material Powers New One-Instruction Computer</title>
		<link>https://bioengineer.org/complementary-2d-material-powers-new-one-instruction-computer/</link>
		
		<dc:creator><![CDATA[Bioengineer]]></dc:creator>
		<pubDate>Wed, 11 Jun 2025 18:20:34 +0000</pubDate>
				<category><![CDATA[Technology]]></category>
		<category><![CDATA[2D materials in electronics]]></category>
		<category><![CDATA[complementary metal-oxide-semiconductor (CMOS) technology]]></category>
		<category><![CDATA[low-power electronics]]></category>
		<category><![CDATA[one instruction set computer (OISC)]]></category>
		<category><![CDATA[semiconductor scaling challenges]]></category>
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					<description><![CDATA[In the relentless pursuit of transcending the physical limitations imposed by silicon-based semiconductor technology, researchers have increasingly turned their gaze toward two-dimensional (2D) materials. Characterized by atomic-scale thickness and excellent carrier mobility, these materials promise to revolutionize the field of microelectronics by delivering unprecedented scaling opportunities and enhanced performance metrics. A recent breakthrough, reported by [&#8230;]]]></description>
		
		
		
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